Power mosfet having planar channel, vertical current path, and top drain electrode

ABSTRACT

In one embodiment, a power MOSFET cell includes an N+ silicon substrate having a drain electrode. An N-type drift layer is grown over the substrate. An N-type layer, having a higher dopant concentration than the drift region, is then formed along with a trench having sidewalls. A P-well is formed in the N-type layer, and an N+ source region is formed in the P-well. A gate is formed over the P-well&#39;s lateral channel and has a vertical extension into the trench. A positive gate voltage inverts the lateral channel and increases the vertical conduction along the sidewalls to reduce on-resistance. A vertical shield field plate is also located next to the sidewalls and may be connected to the gate. The field plate laterally depletes the N-type layer when the device is off to increase the breakdown voltage. A buried layer and sinker enable the use of a topside drain electrode.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of U.S. application Ser. No.14/873,103, filed Oct. 1, 2015, which is a continuation of U.S.application Ser. No. 14/616,395, filed Feb. 6, 2015, which is acontinuation-in-part of U.S. application Ser. No. 14/338,303, filed Jul.22, 2014, now U.S. Pat. No. 9,093,522, issued on Jul. 28, 2015, andclaims priority from U.S. provisional application Ser. No. 61/935,707,filed Feb. 4, 2014, by Jun Zeng et al., and also U.S. provisionalapplication Ser. No. 62/079,796, filed Nov. 14, 2014, by Jun Zeng etal., incorporated herein by reference.

FIELD OF INVENTION

The present invention relates to power MOSFETs and, in particular, to atransistor having a planar DMOS portion, a vertical conduction portion,a buried layer, and a top drain electrode.

BACKGROUND

Vertical MOSFETs are popular as high voltage, high power transistors dueto the ability to provide a thick, low dopant concentration drift layerto achieve a high breakdown voltage in the off state. Typically, theMOSFET includes a highly doped N-type substrate, a thick low dopantconcentration N-type drift layer, a P-type body layer formed in thedrift layer, an N-type source at the top of the body layer, and a gateseparated from the channel region by a thin gate oxide. A sourceelectrode is formed on the top surface, and a drain electrode is formedon the bottom surface. When the gate is sufficiently positive withrespect to the source, the channel region of the P-type body between theN-type source and the N-type drift layer inverts to create a conductivepath between the source and drain.

In the device's off-state, when the gate is shorted to the source ornegative, the drift layer depletes, and high breakdown voltages, such asexceeding 600 volts, can be sustained between the source and drain.However, due to the required low doping of the thick drift layer, theon-resistance suffers. Increasing the doping of the drift layer reducesthe on-resistance but lowers the breakdown voltage.

FIG. 1 is a cross-sectional view of a conventional planar vertical DMOStransistor cell 10 in an array of cells. Planar DMOS transistors arewidely used in numerous power switching applications due to theirruggedness compared to trench MOSFETs. However, the conventional planarDMOS transistors have a higher specific on-resistance (Rsp), which isthe product of on-resistance and active area. It is desirable to haveDMOS transistors with reduced Rsp and lower input, output, and transfercapacitances (Ciss, Coss, and Crss) or gate charge (Qg) to reduce thetransistor's conduction and switching losses.

The important resistance components in the conventional DMOS structureshown in FIG. 1 arise from the voltage drop along the inversion channel12 and the JFET region 14 next to the P-well 16 region. When asufficiently positive voltage is applied to the gate 17, the gate 17inverts the channel 12. The source electrode 18 contacts the N++ sourceregions 20 and the P-well 16, via the P+ contact region 22. A dielectric24 insulates the gate 17 and source electrode 18. When the gate 17inverts the channel 12, a horizontal current path is formed between thesource regions 20 and the low-dopant density N-drift region 24, and thenthe current flows vertically through the N-drift region 24, the N++substrate 26, and the drain electrode 28. The N-drift region 24 needs tobe relatively thick to have a high breakdown voltage, but the low dopantdensity and thickness of the N-drift region 24 increases on-resistance.

The JFET region 14 restricts the current flow, and it is important tominimize the JFET resistance component by using a sufficiently wideP-well spacing (2Y). However, increasing the spacing Y results in anincrease in cell pitch and the active area. Therefore, this tradeoffresults in a limited improvement in Rsp.

What is needed is a planar, vertical DMOS transistor with a good Rsp andwith a smaller surface area, compared to FIG. 1, for increasing celldensity. Further, the transistor should have a high breakdown voltageand high switching speed.

What is also needed is a DMOS transistor that has the improvedattributes mentioned above, but where the drain electrode is on top toallow the integration of the device with other IC components such asCMOS transistors, bipolar transistors, etc.

SUMMARY

New DMOS transistor structures with reduced Rsp and gate charge Qg,while having a high breakdown voltage and high switching speed, aredisclosed.

A MOSFET is formed having a planar channel region, for a lateral currentflow, and a vertical conduction path for a vertical current flow. In oneembodiment, a P-well (a body region) is formed in an N-type layer, wherethere is a trench formed in the N-type layer, deeper than the P-well,resulting in vertical sidewalls of the N-type layer. The N-type layer ismore highly doped than an N-type drift layer below the N-type layer. TheN-type drift layer can be made thinner than the drift layer inconventional vertical MOSFETs while achieving the same breakdownvoltage.

A first portion of the gate overlies the top planar channel region, anda second portion of the gate extends vertically into the trench next tothe vertical sidewall of the N-type layer.

The MOSFET includes a vertical shield field plate formed by a conductivematerial, such as doped polysilicon, filling the trench and insulatedfrom the sidewalls by a dielectric material, such as oxide. The fieldplate is deeper than the P-well to provide an effective electric fieldreduction in the N-type layer by laterally depleting the N-type layer inthe off state. The field plate may be connected to the source, or to thegate, or floating.

Both the vertical portion of the gate and the field plate help todeplete the N-layer laterally when the MOSFET is off to increase thebreakdown voltage. The vertical portion of the gate also accumulateselectrons along the N-type layer sidewalls across from the P-well whenthe MOSFET is on to lower the on-resistance. Therefore, since the JFETregion (between the P-well and trench) can be made narrower withoutunduly constraining the current path, the cells may be smaller. Also,since the N-type layer can be relatively highly doped without reducingthe breakdown voltage, the on-resistance is further lowered. Thecombined effect of the vertical portion of the gate, the field plate,the relatively heavy doped N-type layer, and a reduced thickness N-typedrift layer provides an increased breakdown voltage, loweron-resistance, and a lower cost per die (since the lower on-resistanceper unit area allows each die to be made smaller). The structure allowsa higher density of cells (including strips) due to the loweron-resistance per unit area, enabling a greater current handlingcapability per unit area.

Since the low-dopant-concentration drift region between the N-type layerand the drain electrode can be made thinner without reducing thebreakdown voltage, the on-resistance per unit area (specificon-resistance Ron*Area) is lower than that of the conventional verticalpower MOSFET.

To reduce the gate-drain capacitance for faster switching, the verticalfield plate can be connected to the source electrode (rather than to thegate), and the horizontal gate portion does not extend over the fieldplate.

In one embodiment, the gate, the vertical field plate, and the N-typelayer doping and thickness are chosen such that the N-type layer isfully depleted at the onset of breakdown.

In one application, a load is coupled between the bottom drain electrodeand a positive voltage supply, and the source electrode on the topsurface of the transistor is connected to ground. When the gate issufficiently biased positive with respect to the source electrode,current is supplied to the load.

If the MOSFET is used with an alternating voltage, the MOSFET's PN diodewill conduct when the drain is more negative than the source. When thepolarity reverses and the diode is reverse biased, there is a storedcharge that must be removed prior to the MOSFET being fully turned offafter the gate is biased to an off state. Since there is a higher dopantlevel in the N-type layer, this stored charge is removed faster,enabling a faster switching time. In other words, the MOSFET structurelowers the recovery time after the PN diode is biased on.

IGBT structures are also formed by using P+ substrate.

In another variation, the drain electrode is located on the top of thedevice, and the remainder of the device may be similar to that describedabove. A highly doped (e.g., N+ type) buried layer conducts the currentlaterally to highly doped sinkers that then vertically conduct thecurrent to a drain electrode located on the top of the device. Thisallows the integration of the device with other IC components, such asCMOS transistors, bipolar transistors, etc. Alternatively, the dopedsinkers can be replaced by a deep trench filled with a conductivematerial such as tungsten or doped polysilicon. Further, a deep trenchmay be formed around the sinkers and contain an insulated shield fieldplate to improve breakdown voltage. The sinkers and trench may surroundthe high current MOSFET to insulate it from other components formed inthe same die. The structure may be formed over a substrate having aconductivity type opposite to that of the buried layer, or may be formedover an insulating layer, such as silicon dioxide.

Other embodiments are described.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional view of a conventional planar vertical DMOStransistor cell in an array of identical contiguous cells.

FIG. 2A is a cross-sectional view of a single vertical DMOS transistorcell (which may be a portion of a strip) in an array of identicalcontiguous cells connected in parallel, where the gate conductorincludes a vertical portion surrounding a portion of a vertical sidewall of a trench for improved on-resistance, and wherein a verticalshield field plate is also in the trench for increasing breakdownvoltage, in accordance with one embodiment of the invention.

FIGS. 2B-7C and 9A-10W are also cross-sectional views of a single DMOStransistor cell in an array of identical contiguous cells connected inparallel, in accordance with other embodiments of the invention.

FIG. 2B illustrates the use of a P-shield region below the trench forincreasing breakdown voltage.

FIG. 2C illustrates the use of relatively highly doped P and N columnsfor lowering on-resistance.

FIG. 2D illustrates the use of enhanced N-type surface regions (N-surf)adjacent the P-well for lowering on-resistance.

FIG. 2E illustrates the use of enhanced N-type regions (N-Top) betweenthe trench bottom and P-Shield region for improving turn-off switchingtime.

FIG. 2F illustrates the use of relatively highly doped P and N columnswithout P-Shield region for lowering on-resistance and turn-offswitching time.

FIG. 3A illustrates the P-well extending to the trench for improvedruggedness and to reduce the size of each cell, where the verticalportion of the gate inverts the P-well adjacent to the trench.

FIG. 3B illustrates the use of enhanced N-type surface regions (N-surf)for lowering on-resistance.

FIG. 3C illustrates the use of a P-shield region below the trench forincreasing breakdown voltage.

FIG. 3D illustrates the use of relatively highly doped P and N columnsfor lowering on-resistance.

FIG. 3E illustrates the use of a deep P+ region for improving ruggednessby reducing the effects of a parasitic NPN bipolar transistor.

FIG. 3F illustrates the use of multiple layers of P and N columns toreduce on-resistance.

FIG. 3G illustrates the use of enhanced N-type regions (N-Top) betweenthe trench bottom and P-Shield region for improving turn-off switchingtime.

FIG. 3H illustrates the use of relatively highly doped P and N columnswithout P-Shield region for lowering on-resistance and turn-offswitching time.

FIG. 4A illustrates the gate not overlapping the vertical shield fieldplate to reduce gate-drain capacitance and increase switching speed.

FIG. 4B illustrates the vertical shield field plate connected to thesource metal along a different cross-section.

FIG. 4C illustrates the use of P-type regions (P-Connection) betweenP-Well and P-Shield regions for improving turn-off switching time.

FIG. 5A illustrates the vertical shield field plate being an extensionof the gate for lowering on-resistance, where the gate oxide thicknessis stepped for optimal on-resistance and breakdown performance.

FIG. 5B illustrates the use of P and N columns for loweringon-resistance.

FIG. 6A illustrates the P-well adjoining the trench sidewall forimproved ruggedness.

FIG. 6B illustrates the use of enhanced N-type surface regions forlowering on-resistance.

FIG. 6C illustrates the gate not overlapping the vertical shield fieldplateto reduce gate-drain capacitance and increase switching speed.

FIG. 7A illustrates equi-potential contours in a simulation of thetransistor of FIG. 2C at the onset of breakdown. A central cell is shownalong with portions of adjacent cells. The P-shield and P-column dopingtransitions are outlined.

FIG. 7B illustrates equi-potential contours in a simulation of thetransistor of FIG. 6A at the onset of breakdown, where the P-wellextends to the trench to improve ruggedness.

FIG. 7C illustrates equi-potential contours in a simulation of thetransistor of FIG. 2E at the onset of breakdown, with N-Top region toimprove switching performance.

FIG. 8A is a top down view of a portion of a cell formed as a strip,where the gates are parallel to the trenches, and where identical cellsare adjacent the cell shown.

FIG. 8B is a top down view of a portion of a single cell formed as astrip, where the gates are perpendicular to the trenches, and whereidentical cells are adjacent the cell shown.

FIG. 8C is a top down view of a portion of a single cell formed as aclosed hexagon where identical cells are adjacent the cell shown andshare trenches. The trenches may also form squares, rectangles, etc. toform closed cells.

FIG. 9A illustrates the use of a P+ substrate to form an insulated gatebipolar transistor (IGBT) to lower on-resistance at the expense ofswitching speed.

FIG. 9B illustrates segmented P+ and N+ regions in a substrate to form acombination of an IGBT and a DMOS transistor to lower on-resistance butwith faster switching speed compared to the IGBT of FIG. 9A.

FIG. 9C is similar to FIG. 9B but with a P-well adjacent to the trenchto improve ruggedness.

FIG. 9D illustrates the use of enhanced N-type regions (N-Top layer)between the trench bottom and P-Shield region for improving turn-offswitching time of the IGBT.

FIG. 9E illustrates the use of relatively highly doped P and N columnswithout P-Shield region for lowering on-resistance and turn-offswitching time of IGBT.

FIGS. 10A through 10W illustrate various novel fabrication steps forforming the planar vertical DMOS transistor of FIG. 3D, where an arrayof identical cells are formed connected in parallel.

FIG. 11 illustrates an embodiment where a buried layer conducts currentlaterally to sinkers, which then conduct current vertically to a topdrain electrode.

FIG. 12 illustrates another embodiment with a buried layer and a topdrain electrode, and additionally includes a trench surrounding thetransistor, a shield field plate in the trench, and an insulating layerbelow the transistor to insulate the transistor from other devices inthe die.

Elements that are the same or equivalent in the various figures arelabeled with the same numeral.

DETAILED DESCRIPTION

FIG. 2A is a cross-sectional view of a single vertical MOSFET cell 30 inan array of identical contiguous MOSFET cells connected in parallel inaccordance with one embodiment of the invention. FIGS. 8A-8C, describedlater, illustrate various configurations of the cells, which includestrips and closed cells. In the cross-sectional views, the variousregions are not drawn to scale for ease of illustration. The simulationdiagrams of FIGS. 7A and 7B show more accurate relative dimensions.

In FIG. 2A, the width of the cell 30 shown is about 5-15 microns. Thecell 30 may have a breakdown voltage exceeding 600 volts, and the numberof cells 30 in an array of identical cells determines the currenthandling ability, such as 20 Amps. The array of cells may be in strips,squares, hexagons, or other known shapes.

In one typical application, a load is connected between the bottom drainelectrode 32 and a positive voltage supply, and the top source electrode34 is connected to ground. When a positive voltage is applied to theconductive gate 36 that is greater than the threshold voltage, the topsurface of the P-well 38 is inverted and electrons accumulate along thevertical sidewalls of the N-layer 40 adjacent to the vertical extension42 of the gate 36 to spread the current and lower the on-resistance ofthe N-layer 40. A P+ contact region 37 ohmically connects the P-well 38to the source electrode 34.

The vertical extension 42 of the gate 36 may extend below the P-well 38,but there is a tradeoff between reducing the gate-drain capacitance (byreducing its surface area) and reducing on-resistance by extending thevertical extension 42 deeper into the trench 44.

The N++ source region 46, the P-well 38, and the N-layer 40 top surfaceform a lateral DMOS transistor portion of the MOSFET 30. In theon-state, there is a conductive N-type channel between the sourceelectrode 34 and the drain electrode 32 via the N++ source region 46,the inverted channel of the P-well 38, the N-layer 40, the N-driftregion 48, and the N++ substrate 50.

The combination of the lateral DMOS transistor portion, the higherdoping of the N layer 40, the vertical extension 42 of the gate 36, andthe reduced thickness of the N-drift region 48 reduce the on-resistancecompared to the prior art. This structure also increases the breakdownvoltage compared to the prior art due to the effect of the verticalfield plate 52 (connected to the source) and speeds up the switchingtime if the MOSFETs internal PN diode becomes forward biased thenreversed biased.

A dielectric 53, such as oxide, insulates the source electrode 34.

The trench 44 sidewalls are covered with an oxide layer 54, and thetrench is filled with a conducting material such as polysilicon thatforms the vertical shield field plate 52. The gate oxide 56 thicknessbelow the gate 36 and along the vertical extension 42 of the gate 36 ismuch thinner than the oxide layer 54. This is partially due to the factthat the voltage potential at the top of the N-layer 40 is much lessthan that near the bottom of the N-layer 40 so the oxide can be thinnernear the top without reducing the breakdown voltage.

The vertical shield field plate 52, in combination with the verticalextension 42 of the gate 36, laterally depletes the N-layer 40 when theMOSFET is off to improve the breakdown voltage. The entire N-layer 40 ispreferably totally depleted at the onset of breakdown. The N-driftregion 48 is preferably also totally depleted at the onset of breakdown.

The effect of the vertical extension 42 of the gate 36 (accumulateselectrons along the sidewall) allows a reduction of the P-well 38 totrench 44 spacing S, enabling a reduction of the cell pitch and activearea while still resulting in a lower on-resistance, which results in alower Rsp. The spacing S can be, for example, less than 0.5 to 0.1 ofthe P-well junction depth X_(j). The field plate 52 can be electricallyconnected to the gate 36 or source electrode 34 or can be floating.Connecting the field plate 52 to the source electrode 34 provides alower gate-drain capacitance or lower gate-drain charge Qgd, whileconnecting the field plate to the gate 36 results in a loweron-resistance due to the creation of an electron accumulation layeralong a longer length of the trench sidewalls when the gate 36 is biasedto a positive voltage.

The trench 44 may be 2-20 microns deep. The width of the trench 44(between adjacent cells) may be 1-2 microns. The P-well 38 depth may beabout 2.5 microns. The thicknesses of the N-layer 40 and N-drift region48 are determined based on the desired breakdown voltage and may bedetermined using simulation.

If the cell 30 is a closed cell, such as a hexagon or square, thevertical extension 42 of the gate 36 and the vertical field plate 52surround the N-layer 40. If the cell 30 is a strip, the verticalextension 42 of the gate 36 and the vertical field plate 52 run alongthe length of the N-layer 40.

FIG. 2B shows another embodiment similar to that of FIG. 2A but with aself-aligned P-shield region 60 below the trenches 44. In the off-state,the device is reversed biased and the P-shield region 60 lowers theelectric field under the trench 44, since the P-shield 60 is fullydepleted prior to breakdown, which results in a higher breakdownvoltage. The P-shield region 60 also serves to laterally deplete theN-layer 40 to further increase the breakdown voltage. The P-shieldregion 60 can be floating, but to switch the device on from the offstate, the parasitic capacitor resulting from the depletion layerbetween the P-shield region 60 and N-layers 40 and 48 has to bedischarged. Therefore it is preferable to connect the P-shield region 60to the source electrode 34 via the P-well 38 and a P-type connectionregion in certain locations of the die (not shown). The connection ofthe P-shield region 60 to the source electrode 34 provides a path forcurrent to discharge the capacitor and improves the switching delayduring switching the device from the off to the on state.

FIG. 2C shows another embodiment similar to that of FIG. 2B but with Pand N charge balance columns 64 and 65 to lower the Rsp. The N columns65 are more highly doped than the N-layer 40 so help reduceon-resistance. The N and P columns 64/65 deplete when the device is offand are preferably fully depleted at the onset of breakdown.

FIG. 2D shows another embodiment similar to that of FIG. 2C but with aself-aligned enhanced N-surface region 68 (N-Surf) surrounding the edgeof the P-well 38 and extending to the trench sidewall. The N-surfaceregion 68 has a doping concentration that is higher than the N-layer 40.The vertical extension 42 of the gate 36 accumulates electrons in theN-surface region 68 to further lower its on-resistance. Therefore, theN-surface region 68 provides a lower on-resistance and better currentspreading. It is preferred that the P-shield 60 and the P and N columns64/65 are completely depleted at the onset of avalanche breakdown.

FIG. 2E shows another embodiment similar to that of FIG. 2B but with theself-aligned P-shield region 60 floating and separated from the trenches44 by the N-type N-Top layer 61. It is preferable that the doping in theN-Top layer 61 is higher than the doping of N-layer 40 withoutsignificantly degrading the breakdown voltage. Having the N-Top layer 61on top of the P-shield region 60 results in improved discharge of thedepletion layers' capacitor and reduces the switching delay duringturn-on.

FIG. 2F shows another embodiment similar to that of FIG. 2E but with Pand N charge balance columns 64 and 65 to lower the Rsp. The N columns65 are more highly doped than the N-layer 40 so help reduceon-resistance. The N and P columns 64/65 deplete when the device is offand are preferably fully depleted at the onset of breakdown. Having theP-columns 64 surrounded by N-type regions results in improved dischargeof the depletion layers' capacitor and reduces the switching delayduring turn-on.

FIGS. 3A-6C show other embodiments of devices similar to those of FIGS.2A-2F but with the P-well region 38 adjoining the trench top corner toreduce the size of the cell and to improve ruggedness.

In FIG. 3A, the horizontal portion of the gate 36 inverts the top of theP-well 38, and the vertical extension 42 of the gate 36 inverts the sideof the P-well 36 to create a vertical channel. The vertical extension 42also accumulates electrons in the N-layer 40 adjacent to the verticalextension 42. Therefore, the current path is not constrained by reducingthe size of the cell. The vertical extension 42 can extend deeper intothe trench 44 to further reduce on-resistance; however, there will be anincrease in the gate-drain capacitance, which reduces switching speed.

FIG. 3B shows the use of the N-surface region 68, described above, tofurther lower on-resistance.

FIG. 3C shows the use of the P-shield 60, described above, to increasebreakdown voltage.

FIG. 3D shows the use of the P and N columns 64/65, described above, toreduce on-resistance and increase the breakdown voltage.

FIG. 3E shows another embodiment similar to that of FIG. 3D but with adeep P+ region 70 under the source contact that is deeper than theP-well 38. The P+ region 70 creates an ohmic contact with the sourceelectrode 34 and electrically connects the P-well 38 to the sourceelectrode 34. The P+ region 70 effectively prevents the parasitic NPNbipolar transistor turning on by being a highly doped and lowers thegain of the parasitic NPN transistor. By not allowing the NPN transistorto turn on, there is no thermal runaway caused by high currents throughthe NPN transistor, and no catastrophic secondary breakdown can occur.

FIG. 3F shows another embodiment similar to that of FIG. 3D but withmultiple layers of P and N charge balance columns 64/65, 64A/65A. Byforming the P and N columns as multiple “thin” layers, there is lesslateral dopant spreading so the columns can be formed more precisely.Note how the lower P-columns 64A are wider than the upper P-columns 64due to the additional thermal budget. More than two layers of P and Ncolumns can be formed. It is preferred that the P-shield 60, N-columns65, P-columns 64, N-layer 40, and N-drift region 48 are fully depletedat the onset of avalanche breakdown.

FIG. 3G shows another embodiment similar to that of FIG. 3C but withfloating P-shield 60 and N-Top layer 61 for improved switching speed.

FIG. 3H shows another embodiment similar to that of FIG. 3D but usingthe P and N columns 64/65 without a P-shield region for improvedswitching speed.

FIG. 4A shows another embodiment similar to that of FIG. 3C but with anL shaped gate 36 for minimizing the overlap of the gate 36 and shieldfield plate 52 for a lower gate-drain capacitance to increase switchingspeeds.

FIG. 4B shows the embodiment of FIG. 4A but through a differentcross-section, showing an area where the shield field plate 52 iselectrically connected to the source electrode 34. In other embodiments,the shield field plate 52 may be connected to the gate 36 (which wouldincrease capacitance) or floating.

FIG. 4C shows another embodiment similar to that of FIG. 2B but with aP-Connection region 67 that electrically connects the P-shield region 60to the P-well 38 and source electrode 34 to increase switching speeds.

As in the other embodiments, the vertical extension 42 of the gate 36can extend any distance into the trench 44, including below the P-well38.

FIGS. 5A and 5B show embodiments where the shield field plate 52 is anextension of the gate 36. Since the voltage potential is much less nearthe top of the trench 44, the oxide 54 thickness near the top of thetrench 44 (across from the P-well 38) can be less that that near thebottom of the trench so there is no breakdown of the oxide 54.

FIG. 5B shows the embodiment of FIG. 5A but with the P and N columns64/65, described above.

FIGS. 6A-6C show other embodiments with the P-well region 38 adjoiningthe trench 44 sidewall so there is no surface of the N-layer 40 directlyunder the gate 36. This device has a longer composite lateral andvertical channel where a portion of the channel is planar and anotherportion is vertical. The horizontal and vertical portions of the gate 36are used to invert the channel region. This reduces the gate-draincapacitance and reduces the cell pitch, while also reducing the specificon-resistance. The devices of FIGS. 6A-6C have a longer channel lengthwithout increasing the active surface area. These devices can have ashallower junction depth and are able to provide a lower channel leakagecurrent and a lower saturation current as well as a wider safe operationarea (SOA). The longer channel may also lower the gain of the parasiticNPN transistor to improve the ruggedness of the device by preventingsecondary breakdown. The vertical shield plate 52 may be connected tothe source electrode 34 or to the gate 36 or floating.

FIG. 6B shows the use of the N-surface region 68, previously described.

FIG. 6C shows the gate 36 not overlapping the vertical shield fieldplate 52 to reduce capacitance, as previously described.

FIG. 7A illustrates equi-potential contours in a depletion regionbetween the substrate and the top surface of the device in FIG. 2C in anoff state at the onset of the device breakdown. The full process flowand final device characteristics were simulated by two-dimensionalprocess/device simulation. The transition of the N-type and P-typedopants is shown by the outline, corresponding to the P-shield 60 andthe P-columns 64. The vertical shield field plate 52 is connected to thesource electrode 34. The specific on-resistance of 4.5Ω per mm2 can beachieved for the breakdown voltage of 645V.

FIG. 7B illustrates equi-potential contours in a depletion regionbetween the substrate and the top surface of the device in FIG. 6A,where the edges of the P-well 38 abut the trench sidewalls.

FIG. 7C illustrates equi-potential contours in a depletion regionbetween the substrate and the top surface of the device in FIG. 2E withthe N-Top layer 61 (FIG. 2E).

FIG. 8A is a top down view of a portion of a vertical transistorincorporating any of the embodiments disclosed herein, where thetrenches 44, gates 36, and the various doped regions (source regions 46,P+ contact 37, etc.) are formed as an array of thin strips connected inparallel. Since the trenches 44 take up an area along the X direction,it puts a limitation on the cell pitch reduction of the device. In orderto ease this limitation, the trenches 44 can be laid out perpendicularto the gate 36, as shown in FIG. 8B.

FIG. 8C illustrates a single hexagon closed cell incorporating any ofthe embodiments herein. Adjacent cells share one of the straight trench44 walls (like a honeycomb), and all cells are connected in parallel.Other closed cell designs, such as squares, are also envisioned.

FIG. 9A shows an embodiment similar to those previously described butwith a P+ substrate 80 to form an IGBT structure. An N-buffer layer 81is also shown. In such a case, the drain electrode 32 becomes an anodeor collector electrode. Turning on the IGBT by applying a thresholdvoltage to the gate 36 turns on the PNP transistor. An IGBT has a loweron-resistance compared to the non-IGBT devices, but has a slowerswitching speed. Any of the previously-described devices can be madeinto an IGBT.

FIG. 9B shows the substrate 80 having P+ regions 82 and N+ regions 84 toform IGBT and DMOS transistor devices in parallel. Switching speed isincreased compared to the IGBT of FIG. 9A.

FIG. 9C shows the structure of FIG. 9B but with the P-well 38 abuttingthe trench, as previously described.

FIG. 9D illustrates the use of enhanced N-type regions (N-Top layer 61)between the trench 44 bottom and P-shield region 60 for improvingturn-off switching time of the IGBT.

FIG. 9E illustrates the use of relatively highly doped P and N columns64/65 without the P-shield region for lowering on-resistance andturn-off switching time of the IGBT.

A possible fabrication process of the device of FIG. 3D is describedbelow in FIGS. 10A-10W. A similar process can be used to fabricate anyof the other embodiments.

In FIG. 10A, an epitaxial layer (the N-drift region 48) is grown on topof an N++ substrate 50. The N-drift region 48 may doped in-situ duringgrowth or may be periodically implanted with N-type dopants at a dosageof about 1.5E12 cm². The substrate 50 may have a dopant concentration ofabout 5E19 cm³. The final dopant density in the N-drift region 48 isabout 3.5E14 cm³ for a device with about a 600V breakdown voltage. TheN-drift region 48 may be 30 microns thick.

In FIGS. 10B and 10C, a pad oxide layer 86 is formed and an N-typedopant 88, such as phosphorus, is implanted into the N-drift region 48,followed (FIG. 10C) by a masked P-type dopant 90 implant step (such asusing boron) to form the N-column 65 and P-column 64. The photoresistmask 92 is shown. The N-type implant dosage may be about 1-2E12 cm⁻².The P-type implant dosage may be about 1E13 cm⁻².

In FIG. 10D, a second epitaxial layer forming the N-layer 40 is grownafter the photoresist and oxide are stripped. The N-layer 40 has adopant density of about 2.3E15 cm⁻³, which is higher than the dopantdensity in the N-drift region 48. The N-layer 40 is about 8 micronsthick. In another embodiment, the dopant density in the N-layer 40 isabout the same as that in the N-drift region 48.

In FIG. 10E, an oxide hard mask 94 is formed on top of the N-layer 40.

In FIG. 10F, and additional thick oxide layer 96 is formed.

In FIG. 10G, a photoresist mask 98 is patterned over the oxide layer 96,and the oxide layers 96 and 94 are dry etched to define the trench area.

During the various steps, the dopants in the N and P-columns 65 and 64are driven in and diffused to form a column layer about 4-5 micronsthick, with an N-type dopant concentration in the N-columns 65 of about2E15 cm³, and a P-type dopant concentration in the P-columns 64 of about1E16 cm⁻³. The dopant density in the N-columns 65 may be greater thanthat of the N-layer 40 or less.

In FIG. 10H, an optional N-surface region 68 is implanted using aphosphorus or arsenic implant 100. FIG. 10I shows the resultingN-surface region 68.

In FIG. 10J, a silicon dry etch is carried out to form the trench 44,and a P-type dopant 102 (e.g. boron) is implanted into the trench 44 ina self-aligned manner at a dosage of about 4E12 cm⁻² to create theP-shield 60. The trench etch leaves about 3-4 microns of the N-layer 40below the trench 44. At this step, an optional N-type dopant (e.g.Arsenic) is implanted into the trench 44 in a self-aligned manner at adosage about 2E12 cm⁻² to form an N-Top layer over the P-shield region60.

In a particularly inventive step, the N-surface region 68 has beendiffused laterally into the N-layer 40, then etched to form the trench44. Therefore, the N-surface region 68 is self-aligned with the trench44.

In FIG. 10K, a sacrificial oxide layer 104 is formed having a thicknessof about 1000 Angstroms.

In FIG. 10L, a Field Oxide (FOX) layer 106 is grown or deposited on thewafer surface including the silicon mesa surface, the trench sidewall,and the trench bottom. The thickness of the FOX layer 106 is about 6000Angstroms.

In FIG. 10M, conductive polysilicon 108 is deposited on the wafer tofill up the trench 44, followed by the polysilicon being etched back asshown in FIG. 10N. The polysilicon in the trench 44 forms the verticalshield field plate 52.

In FIG. 10O, with either a wet etch or wet/dry combination process, theFOX layer 106 from FIG. 10N is completely removed from the silicon mesasurface and partially removed along the trench 44 sidewall. Theremaining FOX layer separating the field plate 52 from the trenchsidewall is now labeled the oxide layer 54.

In FIG. 10P, the gate oxide 56 is then grown to a thickness of about 900Angstroms.

In FIG. 10Q, a conductive polysilicon layer 110 is then deposited.

In FIG. 10R, the polysilicon layer 110 is patterned using a photoresistmask 112 and etch to form the gate 36 having the vertical extension 42.

In FIG. 10S, the photoresist 112 is striped and a P-dopant 114 (boron)is implanted into the N-layer 40 to form the P-well 38, self-alignedwith the gate 36. The dopants are then driven in.

In FIG. 10T, an N-type dopant 116 (arsenic or phosphorous) is implantedto form the N-source region 46, self-aligned with the gate 36.

In FIGS. 10U and 10V, a thick liner oxide and a BPSG layer 118 areformed to define the P+ contact region 37, and boron 120 is implanted.

In FIG. 10W, the source metal is deposited and patterned to form thesource electrode 34, such as by sputtering AlCu or AlSiCu, and may beabout 4 microns thick. FIG. 10W is the same as FIG. 3D.

The backside metal is then deposited to form the drain electrode 32,such as by sputtering layers of Ti, Ni, and Ag having respectivethicknesses of 1000, 2000, and 10,000 Angstroms.

All the figures shown are not to scale for ease of illustration. Actualdevice structure dimensions and junction profiles will vary from thoseshown in the above figures depending on the required breakdown voltage,on-resistance, current requirements, etc. The simulation results ofFIGS. 7A and 7B show more accurate representative dimensions.

FIG. 11 illustrates an embodiment with a topside drain electrode. Atopside drain electrode enables the high power MOSFET to be integratedwith other components on the same die, such as CMOS transistors andbipolar transistors.

The basic transistor is similar to the transistor of FIG. 10W and theelements are labeled with numerals used to identify similar elements inthe previous figures. Accordingly, only the differences will beaddressed.

Over a P-substrate 130 is formed a highly doped N+ buried layer 132.Either the top of the substrate 130 may be implanted with N-typedopants, or the buried layer 132 is epitaxially grown to contain thedopants. The N-drift region 48 is grown over the buried layer 132,followed by forming the other transistor components previouslydescribed.

A deep N dopant implant is performed and the dopants are driven in toform an N+ sinker 134 extending from the N+buried layer 132 to the topsurface. An N++ contact region 135 is formed in the top surface forbetter ohmic contact with the drain electrode 138. The transistor cell(or multiple transistor cells) is surrounded by the sinker 134, whichforms a ring. The cell may be circular, rectangular, a strip (ormultiple strips), a hexagon, or other shapes.

Alternatively, the doped sinker 134 can be replaced by a deep trenchfilled with a conductive material such as tungsten or doped polysilicon.

A metal substrate contact 136 is formed on the bottom of the substrate130 and connected to the source electrode 34, such as with a connectorexternal to the silicon die. This isolates the transistor from othercomponents on the same die due to the reversed biased PN junction.

The drain electrode 138 is formed on the top surface in contact with thesinker 134. When the device is turned on, current flows from the sourceelectrode 34, through the source region 46, through the inverted channelof the P-well 38, through the enhanced N-surface region 68, through theN-layer 40, through the N-column 65, through the N-drift region 48, andinto the N+ buried layer 132. The current then flows laterally out tothe surrounding sinker 134 and then vertically through the sinker 134 tothe drain electrode 138.

In FIG. 11, the P-well implant also forms a P-region 140 along the outerportion of the the trench 44, and a portion of the gate 36 is formedover the P-region 140 and along the side of the P-region 140 forinverting the P-region 140 when the transistor is on. This lowers theon-resistance. In the off-state, the P-region 140 increases thebreakdown voltage between the N-drift region 48 and the gate 36.

A portion of the gate polysilicon 144 (insulated from the gate 36)overlies the N-drift region 48 and is connected to the drain electrode138 for enhancing the upper portion of the N-drift region 48 to reducethe electric field near the drain electrode 138 when the device is inthe off state.

In one embodiment, the device, including the sinker 134 and drainelectrode 138, is symmetrical about the center axis of the transistor(through the middle of the P-well 38). In another embodiment, there aremultiple strips of the transistor cells (going in and out of the drawingpage) between parallel sinker 134 walls. Many other shapes can be used.

In another embodiment, the sinker 134 does not completely surround thetransistor.

Any of the various transistor embodiments previously described may usethe buried layer/sinker technique of FIG. 11.

Along the edge of the die or surrounding the high power transistor,there may be conventional termination structures for controlling thebreakdown voltage by distributing the electric field.

FIG. 12 illustrates another embodiment with a top drain electrode 138but where the transistor is formed over an insulating oxide layer 148.

Silicon-On-Insulator (SOI) is well known for isolating components on adie from other components on the die. In one technique, an SOI wafer ispurchased from a manufacturer that grows the oxide layer 148 over asilicon substrate, then bonds a carrier wafer 150 (another substrate) tothe oxide layer 148, then thins the starting substrate for growingepitaxial layers over the thinned substrate surface. The carrier wafer150 may be silicon and can be any conductivity type.

An N+ buried layer 152 is formed over the oxide layer 148, such as byepitaxially growing the buried layer 152 or by doping the thinnedstarting substrate over the oxide layer 148.

A deep implant is then used to form the N+ sinker 154. An N++ contactregion 156 is formed to provide good ohmic contact with the drainelectrode 138.

A tapered trench 158 is etched into the wafer down to the carrier wafer150 such as by RIE, laser, or other technique. An oxide 160 is thenformed over the walls of the trench 158, and a conductive polysiliconfills the trench 158 to form a shield field plate 162. The shield fieldplate 162 may be connected to the source electrode 34, or to the carrierwafer 150, or to the gate 36, or floating and helps distribute theelectric field for improving the breakdown voltage. In anothertechnique, oxide completely fills the trench 158, and an opening isetched in the oxide for filling with the polysilicon. In anothertechnique, the deep implant to form the sinker 154 is performed afterthe trench 158 is formed.

In one embodiment, the oxide 160 is thicker near the top where thevoltage is highest so as to have a higher breakdown voltage compared tonear the bottom of the trench 158.

In another embodiment, the sinker 154 does not surround the transistor.

The operation of the buried layer 152 and sinker 154, and the remainderof the transistor, is the same as described with respect to FIG. 11. Thetrench of FIG. 12 may surround the transistor cell of FIG. 11 foradditional insulation from other devices in the same die.

Any of the disclosed features can be combined in any combination in aMOSFET or IGBT to achieve the particular benefits of that feature for aparticular application. For example, the buried layer 132/152, sinkers134/154, and topside drain electrode 138 of FIGS. 11 and 12 may be usedwith any other embodiment, such as embodiments without the P-shield andcolumns.

While particular embodiments of the present invention have been shownand described, it will be obvious to those skilled in the art thatchanges and modifications may be made without departing from thisinvention in its broader aspects and, therefore, the appended claims areto encompass within their scope all such changes and modifications asfall within the true spirit and scope of this invention.

What is claimed is:
 1. A transistor comprising a substrate; a firstlayer of a first conductivity type above the substrate, the first layerhaving a first dopant concentration; a second layer of the firstconductivity type above the first layer, the second layer having asecond dopant concentration higher than the first dopant concentration,the second layer having a top surface; a trench having a verticalsidewall adjoining the second layer; a well region of a secondconductivity type in the top surface of the second layer, the wellregion having a top surface; a first region of the first conductivitytype in the top surface of the well region, wherein an area between thefirst region and an edge of the well region comprises a channel forinversion by a gate; a conductive gate overlying the channel forcreating a lateral conductive path in the channel when the gate isbiased above a threshold voltage, the gate having a vertical extensioninto the trench, the vertical extension facing the vertical sidewall andinsulated from the sidewall; a first electrode; and a second electrodeelectrically contacting the well region and the first region, whereinwhen a voltage is applied between the first electrode and the secondelectrode and the gate is biased above the threshold voltage, a lateralcurrent flows across the channel and a vertical current flows throughthe first layer and the second layer such that a current is conductedbetween the first electrode and the second electrode.
 2. The transistorof claim 1 further comprising a vertical field plate in the trench, thevertical field plate facing the vertical sidewall and insulated from thesidewall.
 3. The transistor of claim 2 wherein the vertical field plateis connected to the gate.
 4. The transistor of claim 2 wherein thevertical field plate is connected to the second electrode.
 5. Thetransistor of claim 2 wherein the vertical field plate is deeper thanthe well region.
 6. The transistor of claim 2 wherein the vertical fieldplate and the second dopant concentration of the second layer areconfigured to enhance lateral depletion of the second layer in thetransistor's off-state so that the second layer is fully depleted at abreakdown voltage of the transistor.
 7. The transistor of claim 2wherein the vertical field plate surrounds the second layer.
 8. Thetransistor of claim 1 wherein the vertical extension of the gate extendsbelow the well region.
 9. The transistor of claim 1 wherein the wellregion extends to the vertical sidewall.
 10. The transistor of claim 9wherein the vertical extension of the gate inverts a portion of the wellregion abutting the vertical sidewall.
 11. The transistor of claim 1further comprising an enhanced doping region of the first conductivitytype between the well region and the vertical sidewall, and the verticalextension of the gate is insulated from and opposes the enhanced dopingregion for reducing on-resistance.
 12. The transistor of claim 1 whereinthe first electrode is formed on a bottom surface of the substrate. 13.The transistor of claim 12 wherein the substrate is of the firstconductivity type, and wherein the transistor is a vertical MOSFET. 14.The transistor of claim 12 wherein the substrate is of the secondconductivity type, and wherein the transistor is a vertical IGBT. 15.The transistor of claim 1 further comprising: a highly doped buriedlayer of the first conductivity type between the substrate and the firstlayer, the buried layer having a third dopant concentration higher thanthe second dopant concentration; and a vertical conductor extendingthrough at least the first layer and to the buried layer, wherein thefirst electrode is located on a top surface of the transistor, alongwith the second electrode, and contacts the vertical conductor forconducting current flowing through the buried layer.
 16. The transistorof claim 15 wherein the vertical conductor comprises a highly dopedsinker of the first conductivity type.
 17. The transistor of claim 15further comprising an insulating layer between the substrate and theburied layer.
 18. The transistor of claim 17 further comprising aninsulating trench extending through at least the first layer to theinsulating layer.
 19. The transistor of claim 18 wherein the insulatingtrench contains a vertical field plate.
 20. The transistor of claim 1wherein the first conductivity type is an N-type and the secondconductivity type is a P-type.